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WilsonHCG named a Leader and a Star Performer in Everest Group’s 2023 Global RPO Services PEAK Matrix® Assessment

Everest Group RPO Services PEAK Matrix® Assessment 2023 – Global

Everest Group RPO Services PEAK Matrix® Assessment 2023 – Global

TAMPA, Fla., June 28, 2023 (GLOBE NEWSWIRE) — WilsonHCG has been named a Leader and a Star Performer once again in Everest Group’s annual Global Recruitment Process Outsourcing (RPO) Services PEAK Matrix® Assessment.

The PEAK Matrix® analyzes the changing dynamics of the RPO landscape, providing an objective, data-driven comparative assessment of more than 45 RPO providers based on their overall capability across different global services markets.

“We’re honored to be named a Leader and a Star Performer yet again. Our people go above and beyond every day to help our clients’ businesses get better — their dedication to excellence is critical in today’s rapidly evolving talent landscape,” said John Wilson, CEO at WilsonHCG. “We’re also proud of our position as a Major Contender in APAC, as this is a region that we’ve continued to expand in over the past 12 months.”

Commenting on WilsonHCG’s global status as a Leader and a Star Performance, Arkadev Basak, Partner, Everest Group, said: “Along with its deep expertise in sourcing niche high-skilled roles, WilsonHCG stands out due to its global footprint and analytical offerings. Its acquisition of Claro and Tracking Talent has fortified its service offerings and helped position WilsonHCG as a Leader and a Star performer on Everest Group’s Recruitment Process Outsourcing (RPO) Services PEAK Matrix® Assessment 2023 – Global.”

WilsonHCG’s strong track record for hiring high-skill white collar candidates and its doubling down on the healthcare and life sciences (HLS) space was commended by Everest Group, as was its significant delivery capability in North America and strong presence in EMEA.

Other highlights of the assessment include:

  • How WilsonHCG’s network of global delivery centers support multiple buyer industries.
  • The company’s vast web of partnerships with technology vendors.
  • Its acquisition of Claro to provide a market-leading offering for talent market intelligence.

WilsonHCG was also named a Leader and a Star Performer in North America, a Major Contender and a Star Performer in EMEA and a Major Contender in APAC.

Basak continued: “WilsonHCG is a key player in North America due to its strong delivery capabilities and ability to hire niche white collar roles particularly in high-tech, healthcare and life sciences. Its string of organic and inorganic investments to increase market penetration, improve technological capabilities and advisory offerings has helped in its positioning as a Leader and a Star Performer on Everest Group’s Recruitment Process Outsourcing (RPO) Services PEAK Matrix® Assessment 2023 – North America.”

To learn more about the PEAK Matrix® please visit the Everest Group website.

About WilsonHCG

WilsonHCG is an award-winning, global leader in total talent solutions. Operating as a strategic partner, it helps some of the world’s most admired brands build comprehensive talent functions. With a global presence spanning more than 65 countries and six continents, WilsonHCG provides a full suite of configurable talent services including recruitment process outsourcing (RPO), executive search, contingent talent solutions and technology advisory.

TALENT. ™ It’s more than a solution; it’s who we are.

www.wilsonhcg.com

Media contact
Kirsty Hewitt
+44 7889901517
kirsty.hewitt@wilsonhcg.com

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/4e63ef5e-761d-4037-b8b5-adce40d52acd

GlobeNewswire Distribution ID 8866171

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ATP Electronics Launches Industrial 176-Layer PCIe® Gen 4 x4 M.2, U.2 SSDs Offering Excellent R/W Performance, 7.68 TB Highest Capacity

Fastest PCIe Generation Doubles Gen 3 Data Rate, Cuts Latency, Offers Excellent R/W Performance

ATP_Gen 4 M.2 2280 NVMe

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) — ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest high-speed N600 Series M.2 2280 and U.2 solid state drives (SSDs) sporting the 4th generation PCIe® interface and supporting the NVMe™ protocol. The new ATP PCIe Gen 4 SSDs’ 16 GT/s data rate is double that of the previous generation, translating to a bandwidth of 2 GB/s for every PCIe lane.

ATP_Gen 4 M.2 2280 NVMe

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

Using x4 lanes, these SSDs have a maximum bandwidth of 8 GB/s, meeting the growing need for high-speed data transfer in today’s demanding applications and making them suitable for both read/write-intensive, mission-critical industrial applications such as networking/server, 5G, data logging, surveillance, and imaging, with performance on par, if not better, than mainstream PCIe Gen 4 consumer SSDs in the market.

ATP-Gen4-U.2-NVMe_N601Sc

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

176-Layer NAND Flash, Onboard DRAM Offer Exceptional QoS,
Lower Cost per GB with Prime 512 Gbit Die Package

The N600 Series is built on innovative 176-layer 3D NAND flash and uses prime 512 Gbit die package to deliver not only performance improvements over the 64-layer technology, but also price improvements resulting in lower cost per GB.

The M.2 2280 SSDs are available in capacities from 240 GB up to 3.84 TB, while the U.2 SSDs are available from 960 GB to 7.68 TB for more cost-effective options for diverse storage requirements.

ATP_M.2-NVMe_2021_Fin-Type

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

With an outstanding Quality of Service (QoS) rating compared with the previous generation, the N600 Series offers optimal consistency and predictability with higher read/write performance, high IOPS, low write amplification index (WAI), and low latency, thanks to its onboard DRAM. The onboard DRAM delivers higher sustained performance over long periods of operation compared with DRAM-less solutions.

Future-Ready, Long-Term Supply Support

Maximizing SSD lifespan, as well as the availability of replacement units long after similar consumer-grade counterparts have stopped production, is important for business to get the most out of their investments. This is why ATP Electronics is committed to longevity support.

ATP-Gen4-U.2-NVMe_N651Si_7.68TB

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

“We are thrilled to introduce this new product line based on 176-layer triple level cell (TLC) NAND flash. While there are newer iterations of NAND being released in 2XX+layers , these will focus on 1 Tbit and larger density sizes. The 176-layer 3D TLC NAND in 512 Gbit density remains the sweet spot die density for many embedded and specialty applications given their ongoing need for mid and lower SSD device densities.

“Besides a competitive price position, this generation will offer latency improvements and reliability improvements at all temperature ranges. Perhaps even more important to our customer base, this generation will offer product longevity for the foreseeable future. We can work in confidence with our customer base often needing product longevity planning 5 plus years,” said Jeff Hsieh, ATP Electronics President and Chief Executive Officer.

Gen-4-x4-M.2_U.2-SSDs

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

Reliable and Secure Operation
The N600 Series offers a host of reliability, security, and data integrity features, such as:

  • End-to-end data protection, TRIM function support, and LDPC error correction
  • Anti-sulfur resistors repel the damaging effects of sulfur contamination, guaranteeing continued dependable operation even in environments with high sulfur content
  • Hardware-based AES 256-bit encryption and optional TCG Opal 2.0/ IEEE 1667 security for self-encrypting drive (SED)
  • N600Sc Series offers reliable operation in varying temperature shifts with C-Temp (0℃ to 70℃) rating. I-Temp operable (-40℃ to 85℃) N600Si Series will be available for later release.
  • Thermal throttling intelligently adjusts the workload per operating unit time. Throttling stages are pre-configured, allowing the controller to effectively manage heat generation to keep the SSD cool. This ensures stable sustained performance and prevents the heat from damaging the device. Heatsink options are available by project and according to customer request.
  • Power loss protection (PLP) Mechanism. The N600 Series U.2 and upcoming I-Temp rated M.2 2280 SSDs feature hardware-based PLP. Onboard capacitors hold up power long enough to ensure that the last read/write/erase command is completed, and data is stored safely in the non-volatile flash memory. The microcontroller unit (MCU)-based design allows the PLP array to perform intelligently in various temperatures, power glitches, and charge states to protect both device and data. C-Temp rated M.2 2280 SSDs, on the other hand, feature a firmware-based PLP, which effectively protects data that had been written to the device prior to power loss.

Mission-Critical Applications: We Build With You
Depending on project support and customer request, ATP can provide hardware/firmware customization, thermal solutions customization, and engineering joint validation and collaboration.

To ensure design reliability for mission-critical applications, ATP performs extensive testing, comprehensive design/product characterization and specifications validation, and customized testing in mass production (MP) stage, such as burn-in, power cycling, specific testing scripts, and more.

Product Highlights

PCIe® Gen 4 NVMe M.2 2280 PCIe® Gen 4 NVMe U.2
Capacities 240 GB to 3.84 TB 960 GB to 7.68 TB
Operating Temp C-Temp (0°C to 70°C): N600Sc
I-Temp (-40°C to 85°C): N600Si (upcoming)
Thermal Management for Optimal Heat Dissipation •  Nickel-coated copper heat spreader
•  4 mm or 8 mm fin-type heatsink design		 15 mm fin-type heatsink design
Security AES 256-bit encryption
TCG Opal 2.0
Data Integrity End-to-End data path protection
Performance (Read/Write up to) 6,450/6,050 MB/s 6,000/5,500 MB/s
Others Hot-swappable

*By Project Support

For more information on ATP’s N600 Series PCIe Gen 4 x4 M.2 SSDs, visit:
https://www.atpinc.com/products/industrial-gen4-nvme-M.2-ssd
For more information on ATP’s N600 Series PCIe Gen 4 x4 U.2 SSDs, visit:
https://www.atpinc.com/products/industrial-gen4-U.2-ssd

Media Contact on the Press Release: Kelly Lin (Kellylin@tw.atpinc.com)
Follow ATP Electronics on LinkedIn: https://www.linkedin.com/company/atp-electronics

About ATP
ATP Electronics (“ATP”) has dedicated 30 years of manufacturing excellence as the premier provider of memory and NAND flash storage products for rigorous embedded/industrial/automotive applications. As the “Global Leader in Specialized Storage and Memory Solutions,” ATP is known for its expertise in thermal and high-endurance solutions. ATP is committed to delivering add-on value, differentiation and best TCO for customers. A true manufacturer, ATP manages every stage of the manufacturing process to ensure quality and product longevity. ATP upholds the highest standards of corporate social responsibility by ensuring sustainable value for workers, the environment, and business throughout the global supply chain. For more information on ATP Electronics, please visit www.atpinc.com or contact us at info@atpinc.com.

Photos accompanying this announcement are available at:

https://www.globenewswire.com/NewsRoom/AttachmentNg/56be0635-5027-442b-b9e7-c64c43e353d7

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https://www.globenewswire.com/NewsRoom/AttachmentNg/400709dd-4d79-4e2a-ad76-e3bc7266f7a5

https://www.globenewswire.com/NewsRoom/AttachmentNg/933e1523-0df5-485d-9a11-e130864b199b

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ATP Electronics lance les disques SSD industriels 176 couches PCIe® Gén. 4 x4 U.2 et M.2 qui offrent d’excellentes performance en lecture/écriture et une capacité pouvant aller jusqu’à 7,68 To

La génération PCIe la plus rapide offre un débit de données doublé par rapport à celui de la 3e génération, réduit la latence et offre d’excellentes performances en matière de lecture/écriture

ATP_Gen 4 M.2 2280 NVMe

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

TAIPEI, Taïwan, 28 juin 2023 (GLOBE NEWSWIRE) — ATP Electronics, le leader mondial des solutions de stockage et de mémoire spécialisées, lance ses tout derniers disques SSD U.2 et M.2 2280 à haute vitesse de la série N600 dotés de l’interface PCIe® de 4e génération et prenant en charge le protocole NVMe™. Le débit de données de 16 GT/s des nouveaux SSD PCIe de 4e génération d’ATP équivaut au double de celui de la génération précédente, ce qui se traduit par une bande passante de 2 Go/s pour chaque voie PCIe.

ATP_Gen 4 M.2 2280 NVMe_pic3

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

Utilisant des voies x4, ces disques SSD ont une bande passante maximale de 8 Go/s, ce qui répond au besoin croissant de transferts de données à grande vitesse dans les applications exigeantes d’aujourd’hui et les rend adaptés aux applications industrielles critiques intensives en lecture/écriture, telles que les réseaux/serveurs, la 5G, la journalisation de données, la surveillance et l’imagerie, avec des performances égales, voire supérieures, à celles des disques SSD PCIe de 4e génération grand public disponibles sur le marché.

La flash NAND 176 couches et la DRAM intégrée offrent une qualité de service (QdS) exceptionnelle,
et un coût par Go inférieur grâce à l’excellent jeu de puces de 512 Go

La série N600 repose sur l’innovante technologie flash 3D NAND 176 couches et utilise un excellent jeu de puces de 512 Go pour offrir non seulement des performances supérieures à celles de la technologie à 64 couches, mais aussi des améliorations de prix qui se traduisent par une baisse du coût par Go.

ATP-Gen4-U.2-NVMe_N601Sc

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

Les SSD M.2 2280 sont disponibles dans des capacités allant de 240 Go à 3,84 To, tandis que les SSD U.2 sont disponibles dans des capacités allant de 960 Go à 7,68 To, pour des options plus rentables répondant à des besoins de stockage divers.

Avec une évaluation exceptionnelle de sa qualité de service par rapport à la génération précédente, la série N600 offre une constance et une prévisibilité optimales de par des performances de lecture/écriture plus élevées, un fort taux d’IOPS, un faible indice d’amplification de l’écriture (WAI) et une faible latence, grâce à sa DRAM intégrée. La DRAM intégrée offre de meilleures performances soutenues sur de longues périodes de fonctionnement que les solutions sans DRAM.

ATP_M.2-NVMe_2021_Fin-Type

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

Une prise en charge de l’approvisionnement à long terme et préparée pour l’avenir

L’optimisation de la durée de vie des disques SSD, ainsi que la disponibilité d’unités de remplacement longtemps après l’arrêt de la production de leurs homologues grand public, est importante pour que les entreprises tirent le meilleur parti de leurs investissements. C’est pour cela qu’ATP Electronics s’engage à offrir une longue prise en charge.

ATP-Gen4-U.2-NVMe_N651Si_7.68TB

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

« Nous sommes ravis de lancer cette nouvelle ligne de produits basée sur la flash NAND à triple niveau de cellule (TLC) de 176 couches. Bien que de plus récentes itérations de NAND soient commercialisées dans des couches 2XX+, celles-ci se concentreront sur des densités de 1 Tbit et plus. La NAND 3D TLC 176 couches avec une densité de 512 Gbit reste la densité de puces idéale pour de nombreuses applications intégrées et spécialisées, étant donné leur besoin constant de densités de dispositifs SSD moyennes et inférieures.

Gen-4-x4-M.2_U.2-SSDs

ATP Electronics Launches Industrial 176-Layer PCIe Gen 4 x4 M.2 U.2 SSDs Offering Excellent RW Performance 7.68 TB Highest Capacity

« Outre un prix compétitif, cette génération offrira des améliorations en termes de latence et de fiabilité dans toutes les plages de température. Ce qui est peut-être encore plus important pour notre clientèle, c’est que cette génération offrira la longévité du produit pour l’avenir prévisible. Nous pouvons travailler en toute confiance avec notre clientèle qui a souvent besoin de produits d’une durée de vie de 5 ans ou plus », a déclaré Jeff Hsieh, président et directeur général d’ATP Electronics.

Fonctionnement fiable et sécurisé
La série N600 offre une multitude de fonctions de fiabilité, de sécurité et d’intégrité des données, telles que :

  • Protection des données de bout en bout, prise en charge de la fonction TRIM, et correction des erreurs LDPC
  • Les résistances anti-soufre évitent les effets néfastes de la contamination par le soufre, garantissant un fonctionnement fiable en continu même dans les environnements à forte teneur en soufre
  • Cryptage matériel AES 256 bits et sécurité TCG Opal 2.0/ IEEE 1667 en option pour un disque à chiffrement automatique (SED)
  • La série N600Sc offre un fonctionnement fiable en cas de variations de température avec un indice C-Temp (de 0 ℃ à 70 ℃). La série N600Si avec un indice en fonctionnement I-Temp (de -40 ℃ à 85 ℃) sera disponible ultérieurement.
  • La réduction thermique ajuste intelligemment la charge de travail par unité de temps de fonctionnement. Les étapes de réduction sont pré-configurées, ce qui permet au contrôleur de gérer efficacement la production de chaleur afin de maintenir le SSD au frais. Cela garantit des performances stables et durables et empêche la chaleur d’endommager l’appareil. Les options de dissipateur thermique sont disponibles par projet et selon la demande du client.
  • Mécanisme de protection contre la perte de puissance (PLP). La série N600 U.2 et les prochains disques SSD M.2 2280 classés I-Temp sont dotés d’une fonction PLP matérielle. Les condensateurs intégrés maintiennent l’alimentation suffisamment longtemps pour garantir que la dernière commande de lecture/écriture/effacement soit achevée et que les données soient stockées en toute sécurité dans la mémoire flash non volatile. La conception basée sur un microcontrôleur (MCU) permet à la matrice PLP de fonctionner intelligemment face à différents états de charge, températures et problèmes de courant, afin de protéger à la fois le dispositif et les données. Les disques SSD M.2 2280 classés C-Temp, quant à eux, sont dotés d’une PLP basée sur un micrologiciel, protégeant efficacement les données qui avaient été écrites sur le périphérique avant la coupure de courant.

Applications essentielles : nous construisons avec vous
En fonction de la prise en charge du projet et de la demande du client, ATP peut fournir une personnalisation du matériel/micrologiciel, une personnalisation des solutions thermiques, ainsi qu’une validation et une collaboration conjointes en matière d’ingénierie.

Pour garantir la fiabilité de la conception des applications critiques, ATP effectue des essais approfondis, une caractérisation complète de la conception/du produit et une validation des spécifications, ainsi que des essais personnalisés au stade de la production de masse (MP), tels que le déverminage, les mises hors tension et sous tension successives, les scripts d’essais spécifiques et plus encore.

Points saillants des produits

  PCIe® Gén. 4 NVMe M.2 2280 PCIe® Gén. 4 NVMe U.2
Capacités 240 Go à 3,84 To 960 Go à 7,68 To
Température en
fonctionnement		 C-Temp (0 °C à 70 °C) : N600Sc
I-Temp (-40 °C à 85 °C) : N600Si (à venir)
Gestion de la chaleur pour
une dissipation thermique
optimale		 •  Dissipateur de chaleur en cuivre nickelé
•  Dissipateur thermique à ailerons 4 mm ou 8 mm		 Dissipateur thermique à ailettes 15 mm
Sécurité Cryptage AES 256 bits TCG Opal 2.0
Intégrité des données Protection du chemin des données de bout en bout
Performance (vitesse de
lecture/écriture maximale)		 6 450/6 050 Mo/s 6 000/5 500 Mo/s
Autres Possibilité de permuter à chaud

*Selon la prise en charge du projet

Pour tout complément d’information sur les SSD de la série N600 PCIe Gén. 4 x4 M.2 d’ATP, veuillez consulter la page :
https://www.atpinc.com/products/industrial-gen4-nvme-M.2-ssd
Pour tout complément d’information sur les SSD de la série N600 PCIe Gén. 4 x4 U.2 d’ATP, veuillez consulter la page :
https://www.atpinc.com/products/industrial-gen4-U.2-ssd

Contact auprès des médias concernant le communiqué de presse : Kelly Lin (Kellylin@tw.atpinc.com)
Suivez ATP Electronics sur LinkedIn : https://www.linkedin.com/company/atp-electronics

À propos d’ATP
ATP Electronics (« ATP ») est forte de 30 ans d’expérience dans la fabrication d’excellence en tant que premier fournisseur de produits de stockage flash NAND et de mémoire pour des applications embarquées/industrielles/automobiles exigeantes. En tant que « Leader mondial des solutions spécialisées de stockage et de mémoire », ATP est connue pour son expertise dans les solutions thermiques et à haute résistance. ATP s’engage à fournir une valeur ajoutée, une différenciation et un meilleur coût total de possession à ses clients. Fabricant authentique, ATP gère toutes les étapes du processus de fabrication pour assurer la qualité et la longévité. ATP respecte les normes les plus élevées en matière de responsabilité sociale d’entreprise en assurant une valeur durable pour les travailleurs, l’environnement et les entreprises tout au long de la chaîne d’approvisionnement mondiale. Pour plus d’informations sur ATP Electronics, rendez-vous sur www.atpinc.com ou contactez-nous via info@atpinc.com.

Des photos accompagnant ce communiqué sont disponibles aux adresses suivantes :

https://www.globenewswire.com/NewsRoom/AttachmentNg/56be0635-5027-442b-b9e7-c64c43e353d7

https://www.globenewswire.com/NewsRoom/AttachmentNg/3f0e3129-6f53-4366-b5bc-fd0cdc86f5a1

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https://www.globenewswire.com/NewsRoom/AttachmentNg/400709dd-4d79-4e2a-ad76-e3bc7266f7a5

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LeddarTech Releases Production Samples of the LeddarVision Front-Entry (LVF-E) Comprehensive Low-Level Fusion and Perception Software Featuring the TI TDA4VM-Q1 Processor for L2/L2+ ADAS Applications

LeddarTech’s LVF-E’s “B” sample featuring an embedded ECU introduces an unprecedented industry-first solution that brings high performance and reliability of low-level fusion to the entry-level ADAS market

QUEBEC, June 28, 2023 (GLOBE NEWSWIRE) — LeddarTech®, an automotive software company that provides patented disruptive low-level sensor fusion and perception software technology for ADAS and AD, is pleased to announce that “B” samples of its LeddarVision™ entry-level ADAS L2/L2+ highway assist and 5-star NCAP 2025/GSR 2022 low-level fusion and perception software stack optimized for the TDA4VM-Q1 (8 TOPS) processor from Texas Instruments are now available.

The LeddarVision Front-Entry (LVF-E) product, formally released in late 2022, was designed for customers seeking to develop entry-level ADAS safety and highway assistance L2/L2+ applications. Introducing the “B” samples brings exciting advancements to LVF-E powered by a Texas Instruments (TI) TDA4VM-Q1 processor. By leveraging these “B” samples, LVF-E delivers substantial cost and performance benefits for low-level fusion, paving the way for accelerated L2/L2+ systems adoption. In addition, this breakthrough effectively reduces the sensor and processor requirements, making it more accessible and efficient for widespread implementation. The LeddarVision Front-Entry solution also marks the first design where TI’s highly integrated and cost-efficient TDA4x processor family has been featured in a low-level fusion solution.

Benefits

  • Higher Performance:
    • Doubles the effective range of the sensors, allowing high-performing ADAS targeting 5-star NCAP 2025 and GSR 2022 standards with lower sensor and system costs.
  • Lower Costs:
    • Reduced hardware requirements: An industry-first being enabled with a single 1 to 2-megapixel 120-degree front camera and two short-range front corner radars in a 1V2R configuration.
    • Efficient implementation on the TDA4VM-Q1 platform achieves one of the lowest system costs for L2/L2+ entry-level ADAS without sacrificing system performance.

Visit LeddarTech’s LVF-E product page for more information and to request a demo.

“OEMs and Tier 1s strive to enhance the affordability of ADAS. LeddarTech achieves this by reducing the sensor count and costs, simplifying systems and lowering processor costs while delivering high-performance low-level fusion (LLF) and perception in an auto-grade ECU. Demonstrating the compatibility of low-level fusion with TI’s TDA4VM-Q1 processor is a powerful market statement. The availability of ‘B’ samples of our LVF-E software stack showcases a cost-effective perception solution using LLF, marking a significant milestone for LeddarTech’s technology on the popular TDA4x family of processors,” stated Charles Boulanger, CEO of LeddarTech.

About LeddarTech

A global software company founded in 2007 and headquartered in Quebec City with additional R&D centers in Montreal, Toronto and Tel Aviv, Israel, LeddarTech develops and provides comprehensive perception software solutions that enable the deployment of ADAS and autonomous driving (AD) applications. LeddarTech’s automotive-grade software applies advanced AI and computer vision algorithms to generate accurate 3D models of the environment, allowing for better decision making and safer navigation. This high-performance, scalable, cost-effective technology is available to OEMs and Tier 1-2 suppliers to efficiently implement automotive and off-road vehicle ADAS solutions.

LeddarTech is responsible for several remote-sensing innovations, with over 150 patents granted or applied for that enhance ADAS and AD capabilities. Better awareness around the vehicle is critical in making global mobility safer, more efficient, sustainable and affordable: this is what drives LeddarTech to seek to become the most widely adopted sensor fusion and perception software solution.

Additional information about LeddarTech is accessible at www.leddartech.com and on LinkedIn, Twitter, Facebook and YouTube.

Contact:
Daniel Aitken, Vice-President, Global Marketing, Communications and Investor Relations, LeddarTech Inc. Tel.: + 1-418-653-9000 ext. 232 daniel.aitken@leddartech.com

Leddar, LeddarTech, LeddarVision, LeddarSP, VAYADrive, VayaVision and related logos are trademarks or registered trademarks of LeddarTech Inc. and its subsidiaries. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.

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Sensegen launches bio-based Exotic Flavors collection

Unveiling at IFT First 2023 in Chicago July 17 – 19

Rancho Santa Margarita, Calif., June 27, 2023 (GLOBE NEWSWIRE) — Sensegen, the pioneering biotechnology-based solution provider in taste, smell, and beauty, has launched its highly anticipated Exotic Flavors collection.

Sensegen has created a range of captivating flavors for food and beverages. The collection features six unique exotic true-to-fruit flavors: lychee, guava, papaya, yuzu, dragon fruit, and violet.

“We are thrilled to introduce the Exotic Flavors collection to the market, representing a significant milestone in our mission to redefine taste and consumer experiences,” said Natasha D’Souza, VP of Flavors and Consumer Experience at Sensegen.

“Our research has revealed that exotic flavors transcend vacation settings and have become a top preference for various occasions and drink preferences. By leveraging our bio-based solutions, we invite food and beverage companies to explore the immense potential of these flavors across different categories and create truly personalized experiences for their consumers,” said D’Souza.

According to Sensegen’s Sensory and Consumer Insights Center, 48% of consumers identified exotics as a top flavor. Consumers are open to more adventurous flavors in social settings or when they feel exploratory. In alcoholic beverages, consumers consider unique, exotic, and natural flavors as the top three desired characteristics.

Sensegen will unveil the Exotic Flavors collection at IFT First in Chicago, July 17-19, 2023, at its creative partner Blue California’s booth S1670. In anticipation of the collection, IFT attendees will be the first to taste food and beverage prototypes made with the flavors and complimentary ingredients from Sensegen’s sugar reduction solutions partner Sweegen.

What to Experience at IFT First 2023
IFT Attendees can expect several exciting prototypes to inspire their products with the Exotic Flavors.
A sneak preview is below.

  • Yuzu-flavored iced tea featuring Sensegen’s yuzu natural flavor with Blue California’s longevity vitamin ergothioneine and Sweegen’s Signature Stevia and taste modulation solutions.
  • Dark chocolate truffles flavored with Sensegen lychee and natural violet flavor. 
  • A better-for-you Guava energy drink made with Sensegen’s guava natural flavor and 50% reduced sugar with Sweegen’s Sweetensify Flavors for taste modulation. Guava has risen 22% YOY in beverages and 5% on restaurant menus.
  • Papaya-flavored refresher featuring Sensegen’s papaya natural flavor. Papaya has increased by 19% on restaurant menus.
  • Dragon fruit-flavored sparkling water flavored with Sensegen’s dragon fruit natural flavor.

This launch results from Sensegen’s relentless pursuit of innovation and commitment to providing consumers with unique taste experiences. The Exotic Flavors collection is supported by the company’s proprietary quantitative research conducted nationally with over 1,500 consumers. This comprehensive study explored the beverage and food choices people make in various situations, the influence of mood on those decisions, and the underlying reasons behind them.

Sensegen’s insights from this research offer invaluable guidance to food and beverage companies seeking to inspire innovation with mood-centric flavors. By understanding that mood, food, and beverage choices can vary significantly among individuals, industry players can use this research to tap into the full potential of their offerings and deliver tailored experiences to their diverse consumer base.

In line with Sensegen’s commitment to sustainability and biotechnology, the Exotic Flavors collection is produced by bioconversion. This approach ensures the highest quality and authenticity while minimizing the environmental impact of flavor production.

About Sensegen
Sensegen™ is the science of good sense. We’ve got nature down to a science.

As a division of Blue California Ingredients, our innovative taste, smell, and beauty creative center is dedicated solely to delivering plant-based, natural, and sustainable solutions. Our diverse team of experts collaborates with advanced bio-techniques and collaborates as a team to provide unique consumer-validated ingredients.

At Sensegen™, we’ve pioneered a way of formulating nature without compromise or harm, providing one-of-a-kind solutions for Taste, Smell, and Beauty.

Attachments

Ana Capretz, Head of PR and Communications
Sensegen
+1.949.635.1991
ana.capretz@sensegen.com

GlobeNewswire Distribution ID 8865558

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Zoom brings together in-office and remote employees with the launch of Intelligent Director for Zoom Rooms

AI-powered Intelligent Director enhances connection and optimizes the conference room experience for hybrid work, using multiple cameras to give every participant their own space in Zoom Meetings

SAN JOSE, Calif., June 27, 2023 (GLOBE NEWSWIRE) — Today Zoom Video Communications, Inc. (NASDAQ: ZM) announced the launch of the award-winning Intelligent Director for Zoom Rooms. For hybrid meetings with a Zoom Room, Intelligent Director uses AI and multiple cameras to provide the best image and angle of participants in the room so remote participants can see each person clearly, even in large conference rooms.

“As more people return to the office, it’s no longer enough to deliver the best remote worker experience; every business needs a solution to deliver the best hybrid meeting experience,” said Smita Hashim, chief product officer at Zoom. “Even with some employees in the office, oftentimes other team members are dispersed, so meeting equity and inclusion become more important than ever. Intelligent Director is the solution that can bring employees together, regardless of location, so they can truly connect face-to-face.”

Intelligent Director is specifically designed for medium- to larger-sized rooms and helps avoid the “bowling alley effect.” Intelligent Director can individually frame up to 16 participants in a Zoom Room using multiple cameras, choosing the best video stream via a Zoom-designed AI, and send that stream to the gallery view of the Zoom Meeting.

An evolution of Zoom’s Smart Gallery feature, which uses a single camera and AI to give each person in a small to medium-sized room their own space in a Zoom Meeting, Intelligent Director takes this same technology to the next level for larger conference rooms.

For bigger meeting spaces, it is easier to be hidden by others when only using a single camera, so Intelligent Director’s multi-camera configuration and use of video AI technology provide meeting equity to everyone in the room, selecting the best view of each individual, even if they move around or turn their heads. Remote participants can now have face-to-face conversations with each Zoom Rooms participant, allowing in-room participants to be seen and heard.

Intelligent Director is made possible through the support of Zoom’s hardware partner ecosystem. Manufacturers, including Apple, AVer, Dell, HP | Poly, Intel, Logitech, and Yealink have supported Zoom with the computer, controller, and camera solutions necessary to produce this major advancement.

About Zoom
Zoom is an all-in-one intelligent collaboration platform that makes connecting easier, more immersive, and more dynamic for businesses and individuals. Zoom technology puts people at the center, enabling meaningful connections, facilitating modern collaboration, and driving human innovation through solutions like team chat, phone, meetings, omnichannel cloud contact center, smart recordings, whiteboard, and more, in one offering. Founded in 2011, Zoom is publicly traded (NASDAQ:ZM) and headquartered in San Jose, California. Get more info at zoom.com.

Zoom Public Relations
Lacretia Taylor
press@zoom.us

GlobeNewswire Distribution ID 8865322

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IAVI Starts First-in-Human Phase I Clinical Trial of Single-Dose Sudan Virus Vaccine Candidate

NEW YORK, NY / ACCESSWIRE / June 27, 2023 / IAVI announced today that the first participants have been vaccinated with a Sudan virus (SUDV) vaccine candidate in a first-in-human Phase I clinical trial in the U.S. The IAVI-sponsored trial is funded by the Biomedical Advanced Research and Development Authority (BARDA), part of the Administration for Strategic Preparedness and Response (ASPR) within the U.S. Department of Health and Human Services (HHS).

Known as IAVI C108, this first-in-human study is designed to evaluate the safety and immunogenicity of an investigational SUDV vaccine candidate donated to IAVI by Merck (known as MSD outside the U.S. and Canada) to supplement IAVI’s ongoing SUDV vaccine development program. This investigational SUDV vaccine candidate was produced for IAVI from existing investigational bulk drug substance previously manufactured by Merck. IAVI is the vaccine candidate’s regulatory sponsor. IAVI is responsible for all aspects of the candidate’s future development, including demonstrating equivalence between this SUDV vaccine candidate and IAVI’s other SUDV vaccine candidate, which utilizes the same viral vector but is manufactured using a new production platform.

The SUDV vaccine candidate being evaluated in IAVI C108 uses the same recombinant vesicular stomatitis virus (rVSV) viral vector platform as ERVEBO®, Merck’s single-dose Zaire ebolavirus (ZEBOV) vaccine which is licensed in the U.S., U.K., European Union, Canada, Switzerland, and 10 African countries. rVSV is also the platform technology utilized in IAVI’s portfolio of emerging infectious disease (EID) candidates.

“IAVI C108 represents an important first step toward generating the data needed for eventual licensure of an rVSV-SUDV vaccine. The development and licensure of ERVEBO® has resulted in an important tool in Ebola Zaire outbreak response. If proven effective, we’re hopeful that a vaccine candidate built on the same viral platform will be similarly important in future SUDV outbreaks,” said Swati Gupta, Ph.D., vice president and head of emerging infectious diseases and epidemiology at IAVI. “In parallel, we must continue accelerating efforts toward the adequate availability of candidate vaccine doses for evaluation during and ahead of outbreaks with key partners, collaborators, and funders. We’re grateful to Merck for donating the doses that will be used in IAVI C108 and to BARDA for its support of this trial.”

IAVI C108 will take place at two U.S.-based clinical trial sites, where the study vaccine will be administered intramuscularly at three dosage levels. This is a placebo-controlled, single-blind study, meaning that only the researchers conducting the study will know whether a participant has received a vaccine dose or a placebo dose until after the trial is over. Approximately 36 healthy adults will be enrolled and will be followed for six months after vaccination to monitor their safety and immune responses to the vaccine candidate.

Like ZEBOV, SUDV is responsible for recurring viral hemorrhagic fever outbreaks, which have had lasting impacts on health security and geopolitical stability across sub-Saharan Africa. The estimated case fatality ratios of SUDV disease have varied from 41% to 100% in past outbreaks[1]. Despite high morbidity and mortality, there are no vaccines or therapeutics licensed for the prevention and treatment of SUDV. Existing ZEBOV vaccines and treatments are not effective against SUDV. Data being generated from ongoing studies suggest that rVSV could be a safe and effective platform for responding to SUDV and other related pathogens[2].

IAVI’s rVSV-based EID portfolio includes a SUDV vaccine candidate supported by BARDA; a Lassa fever virus vaccine candidate currently in a Phase I trial and supported by the Coalition for Epidemic Preparedness Innovations and the European & Developing Countries Clinical Trials Partnership; a Marburg virus vaccine candidate supported by BARDA and the Defense Threat Reduction Agency (DTRA) of the U.S. Department of Defense (DOD); and an intranasal SARS-CoV-2 vaccine candidate supported by DOD DTRA and the Japan Ministry of Finance.

The rVSV platform has been used extensively in adults and children[3]. The underlying vesicular stomatitis virus (VSV) is a common animal virus that does not cause serious illness in humans and has been investigated extensively as a vaccine vector. In the vaccine platform, it is engineered to encode a surface protein from a target pathogen – in this case, SUDV – to prompt the body to mount an immune response.

Much of the research and development on IAVI’s rVSV platform is performed at the IAVI Vaccine Design and Development Lab (DDL) in Brooklyn, New York. The DDL is located at the bioscience center in the historic Brooklyn Army Terminal. Since its founding in 2008, the IAVI DDL has become one of the world’s leading viral vector vaccine research and development labs, known for innovation and generation of novel vaccine design concepts.

Scientists with IAVI’s Human Immunology Laboratory (HIL) in London, U.K., are involved in processing participant samples and developing the analytical assays needed to evaluate IAVI C108 participants’ immune responses. Established in 2001, the HIL is fully integrated into the Infectious Disease department within the Faculty of Medicine at Imperial College London and serves as the clinical immunology reference laboratory for IAVI and the network of clinical research centers with which IAVI collaborates worldwide.

Media Contact
Rose Catlos
Rcatlos@iavi.org
212-847-1049

About IAVI
IAVI is a nonprofit scientific research organization dedicated to addressing urgent, unmet global health challenges including HIV, tuberculosis, and emerging infectious diseases. Its mission is to translate scientific discoveries into affordable, globally accessible public health solutions. Read more at iavi.org.

Follow IAVI on Facebook, LinkedIn, Instagram, and YouTube, and subscribe to our news updates.

About IAVI’s rVSV vaccine candidates
IAVI holds a nonexclusive license to the rVSV vaccine candidates from the Public Health Agency of Canada (PHAC). The vector was developed by scientists at PHAC’s National Microbiology Laboratory.

IAVI initially developed its rVSV vector for HIV vaccine candidates and has since expanded its use to the development of vaccines addressing emerging infectious diseases (Lassa Fever, Marburg, Sudan ebolavirus, and COVID-19).

Funders who have made the development of IAVI’s rVSV-vectored vaccine candidates possible include the Bill & Melinda Gates Foundation; the Government of Canada; the Danish Ministry of Foreign Affairs; the Government of Japan; the Irish Department of Foreign Affairs and Trade; the Netherlands Ministry of Foreign Affairs; the Norwegian Agency for Development Cooperation; the U.K Department for International Development; the U.S. National Institutes of Health; and through the generous support of the American people from the United States Agency for International Development.

This project is funded in whole or in part with federal funds from the Department of Health and Human Services; Administration for Strategic Preparedness and Response; Biomedical Advanced Research and Development Authority under contract number 75A50121C00077.

[1] https://www.who.int/emergencies/disease-outbreak-news/item/2022-DON410

[2] https://link.springer.com/article/10.1007/s11262-017-1455-x

[3] https://cdn.who.int/media/docs/default-source/blue-print/who-vaccine-prioritization-report-uganda-ebola-trial-nov-16-2022.pdf

SOURCE: IAVI

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ePac Flexible Packaging Announces the Official Opening of its Plant in Accra, Ghana

Global company ready to serve brands of all sizes throughout West Africa

Austin, Texas USA, June 26, 2023 (GLOBE NEWSWIRE) — ePac Flexible Packaging, an industry leader in custom flexible packaging, is pleased to announce the opening of its new Grade A 2,200 square meter production plant on the Spintex Road in Accra, Ghana. A grand opening celebration was held on June 22nd with nearly 150 local dignitaries, government officials, customers, and media in attendance.

Since its establishment  in 2021, ePac West Africa, has served a number of customers across Africa, including customers from Ghana, Nigeria, Senegal and Zanzibar, with fulfillment handled by ePac’s plants in the UK and Lyon, France. With the opening of the new plant, ePac West Africa is uniquely positioned to serve CPG brands of all sizes throughout the region with competitively priced flexible packaging and industry best turnaround times.

According to Victor Sosah, General Manager of ePac West Africa: “ePac is poised to serve the West African community with the highest quality packaging that has been proven to help small
and medium enterprises grow. With our first facility in the region located in Ghana, we can help our customers, and consumers alike,  “buy-local” in support of the government initiatives to increase local food manufacturing and reduce imports”.

Mr. Sosah added: “No longer will local brands need to accept inferior packaging, or source it from overseas. With ePac’s all-digital platform we’re able to reduce lead times on packaging orders from months to 15 business days (following artwork approval), while enabling brands to order to demand and avoid costly excess inventory and obsolescence”.

According to ePac CEO Jack Knott: “the opening of the plant in Ghana represents a significant milestone in ePac’s global expansion. I am excited that we are able to provide a great packaging option which allows brands to compete for space on local supermarket shelves and introduce new products to international markets.”

About ePac:
ePac is the world’s largest networked flexible packaging provider, serving brands of all sizes across the globe. Founded in 2016, ePac began with a single plant in Madison, Wisconsin serving predominantly community-based small and medium sized brands. Today, through its proprietary technology platform – ePacONE (One Network Everywhere), ePac provides brands, large and small alike, the ability to produce any size order anywhere across its 25 facilities across the globe.

ePac offers a full complement of sustainable film options, while its print technology platform is carbon-neutral and inherently eco-friendly. Further, the company offers true order to demand capability, helping brands reduce inventory and obsolescence.

Attachments

Carl Joachim
ePac Flexible Packaging
+1 561-573-7992
cjoachim@ePacFlexibles.com

Victor Sosah
ePac West Africa
+233 501 333 162
vsosah@ePacFlexibles.com

GlobeNewswire Distribution ID 8864009